From September 22 to 25, 2025, the 15th International Conference on Shot Peening (ICSP-15) brought together more than 150 participants from across the globe at Purdue University, West Lafayette, Indiana. With attendees representing dozens of countries and industries ranging from aerospace and automotive to energy and advanced manufacturing, the event reaffirmed ICSP’s role as the premier international forum for developments in mechanical surface treatments.
A Four-Day Exchange of Knowledge
ICSP-15 was hosted by Purdue’s School of Materials Engineering in partnership with the Center for Surface Engineering & Enhancement (CSEE). Over the course of four days, the program combined keynote lectures, technical sessions, poster presentations, and a vibrant trade exhibition. The balance between academic insight and industrial application created a fertile ground for both scientific advancement and real-world implementation.
The conference opened with a plenary session illustrating how knowledge of shot peening and the dynamics of shot impact can also be applied to the redesign of Roman war machines, based on the analysis of craters left by projectiles launched during the siege of Pompeii—before the city was destroyed by the volcanic eruption. Then, in the thematic sessions it was underlined that with the aerospace and energy sectors pushing materials to their limits, and additive manufacturing (AM) presenting new challenges in surface integrity, the need for innovative processes and reliable standards has never been greater.
Scale and Reach
The statistics alone demonstrate the reach of ICSP-15. More than 150 attendees travelled from dozens of countries, underscoring the global nature of the shot peening community. Researchers, engineers, and equipment suppliers shared not only scientific papers but also practical case studies and field experiences.
A major highlight was the trade show, where 24 booths showcased the latest in peening equipment, media, process control systems, and testing instrumentation. From established industry leaders to emerging technology providers, exhibitors offered a comprehensive look at how theory translates into industrial practice. For many delegates, this direct exposure to equipment and suppliers provided an invaluable complement to the technical sessions.
Key Themes and Technical Highlights
The technical program covered the full breadth of shot peening and surface enhancement, with several recurring themes:
1. Advanced Modeling and Simulation
Numerous presentations explored how finite element analysis, discrete element modeling, and hybrid computational approaches can more accurately predict residual stress distributions and fatigue life improvements. These models are increasingly essential for industries that demand reproducible, certifiable performance from their surface treatments.
2. Process Monitoring and Quality Control
With tighter tolerances and increasing reliance on automated systems, process monitoring was a major focus. Presentations highlighted new diagnostic tools for real-time coverage measurement, media flow analysis, and in-situ stress evaluation. These tools not only improve reliability but also align with the industry’s push toward digitalization and “smart” manufacturing.
3. Additive Manufacturing Applications
A rapidly growing area of interest was the application of shot peening and allied processes to additively manufactured parts. Presenters shared results showing how surface treatments can mitigate roughness, close surface defects, and impart beneficial compressive stresses to extend the fatigue performance of AM components. This is especially critical in aerospace and biomedical applications, where reliability is paramount.
4. Hybrid and Emerging Processes
While conventional shot peening remains the backbone of surface enhancement, ICSP-15 featured significant discussion of hybrid processes such as micro-shot peening, ultrasonic peening, and laser shock peening. By combining mechanical impact with thermal or photonic energy, these techniques are opening new pathways for tailoring surface properties at micro- and nano-scales.
5. Standards and Best Practices
Another highlight was the discussion of evolving standards. With aerospace and automotive sectors demanding harmonized global guidelines, several sessions focused on how to refine specifications, ensure reproducibility, and align with international quality systems. These sessions reinforced ICSP’s role as not just a scientific gathering but also a driver of industry-wide consensus.
The Exhibition: 24 Booths of Innovation
The exhibition hall was consistently busy, with 24 booths representing equipment manufacturers, media suppliers, instrumentation companies, and service providers. Exhibitors included well-established global players as well as specialized niche suppliers. For attendees, the chance to engage directly with manufacturers, discuss new developments, and see equipment demonstrations was a major draw.
The exhibition also fostered informal networking. Coffee breaks and poster sessions held in proximity to the booths encouraged conversation between delegates and exhibitors, ensuring that technical knowledge flowed freely between theory and practice.
Networking and Community Spirit
Beyond the lectures and exhibition, ICSP-15 featured a strong social and networking program. Welcome receptions, poster socials, and conference dinners provided opportunities to strengthen old connections and build new ones. The atmosphere reflected the close-knit yet global nature of the shot peening community: researchers and engineers who may compete in business or academia nevertheless share a common passion for surface engineering.
A special highlight was the opportunity to tour Purdue’s Materials & Manufacturing Research Laboratory (MMRL), which recently installed a pilot-scale robotic shot peening system. This state-of-the-art facility, developed in collaboration with industry partners, demonstrates the university’s commitment to advancing applied research in the field. For many attendees, the visit provided inspiration for future collaborations and joint research projects.
A Tradition of Excellence
The ICSP series, now in its 15th edition, has established itself as the definitive event in the shot peening calendar. Since its inception, ICSP has rotated across continents, reflecting its international character. Each edition builds on its predecessors, addressing emerging challenges while reinforcing fundamental principles.
ICSP-15 maintained this tradition, while also signaling new directions. The focus on additive manufacturing, hybrid processes, and digitalized monitoring systems illustrates how the community is adapting to modern manufacturing realities. The trade exhibition’s diversity highlighted the industry’s readiness to provide tangible solutions.
The next conference, ICSP-16, is scheduled for 2028 and will be held in Gifu Prefecture, Japan.
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